Plating substrate, electroless plating method, and circuit...

Details Plating substrate, electroless plating method, and circuit... Plating substrate, electroless plating method, and circuit...

2007-11-20

2007-11-20

Lavilla, Michael E. (Department: 1775)

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

C428S630000, C428S632000

Reexamination Certificate

active

11251349

ABSTRACT:
An electroless copper plating method is provided having a first catalyst step of forming a first catalyst layer on a ceramic base material containing a glass component using a tin chloride solution and a palladium chloride solution; a pre-copper-plating heat treatment step of heating the ceramic base material in an atmosphere containing oxygen; a laminate catalyst treatment step of forming a laminate catalyst layer on the ceramic base material using a tin chloride solution and a palladium chloride solution; a plating treatment step of forming a copper plating film on the ceramic base material using a copper plating solution containing a small amount of nickel ions; and a post-copper-plating heat treatment step of heating the ceramic base material at a heat treatment temperature not more than the glass transition temperature thereof.

REFERENCES:
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patent: 6743479 (2004-06-01), Kanoh et al.
patent: 2000-054153 (2000-02-01), None
patent: 2004-332023 (2004-11-01), None

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