Plating solutions for electrochemical or chemical deposition...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating

Reexamination Certificate

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C205S291000, C106S001260

Reexamination Certificate

active

07147767

ABSTRACT:
The present invention provides plating solutions having either copper bis(perfluoroalkanesulfonyl) imides or copper tris(perfluoroalkanesulfonyl) methides and methods of electrochemically or chemically depositing copper interconnects using these plating solutions.

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