Plating rate improvement for electroless silver and gold plating

Details Plating rate improvement for electroless silver and gold plating Plating rate improvement for electroless silver and gold plating

1993-08-11

1994-06-07

Klemanski, Helene

Compositions: coating or plastic

Coating or plastic compositions

Metal-depositing composition or substrate-sensitizing...

106 126, C23C 1831

Patent

active

053186214

ABSTRACT:
An electroless silver or gold plating solution comprising a noncyanide metal complex, a thiosulfate, a sulfite, and at least one amino acid. These electroless plating solutions containing an amino acid exhibit an accelerated plating rate compared to identical solutions lacking amino acids.

REFERENCES:
patent: 4142902 (1979-03-01), Burke et al.
patent: 4374876 (1983-02-01), El-Shazly et al.
patent: 4880464 (1989-11-01), Ushio et al.
patent: 5106413 (1992-04-01), Takehawa
patent: 5178918 (1993-01-01), Duva et al.
patent: 5232492 (1993-08-01), Krulik et al.
G. Mallory, J. Hajdu, Eds., "Electroless Plating: Fundamentals and Applications", 1990, American Electroplaters & Surface Finishers Soc, Ch. 15 Electroless Plating of Gold . . . ; Ch. 17, Electroless Plating of Silver.

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