Electricity: conductors and insulators – Conduits – cables or conductors – Preformed panel circuit arrangement
Patent
1999-04-06
2000-12-26
Gaffin, Jeffrey
Electricity: conductors and insulators
Conduits, cables or conductors
Preformed panel circuit arrangement
438618, 29843, H01R 1204, H05K 111
Patent
active
061663344
ABSTRACT:
Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped structure which allows interconnections to bonding pads of electronic components with pitches less than 9 mils.
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Metal Finishing 63rd Guidebook and Directory Issue vol. 93 No. 1A, Jan., 1995, (3 pages).
Gaffin Jeffrey
Integrated Device Technology Inc.
Norris Jeremy
LandOfFree
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