Metal fusion bonding – Process – Plural joints
Patent
1997-01-10
1999-09-28
Ryan, Patrick
Metal fusion bonding
Process
Plural joints
228246, 228254, B23K 3102
Patent
active
059573708
ABSTRACT:
Apertures in a tape formed on a substrate allow straight plating of solder bumps to heights above 4 mils. The solder bumps are combined with a lower density material to form an hourglass-shaped structure which allows interconnections to bonding pads of electronic components with pitches less than 9 mils.
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Metal Finishing 63rd Guidebook and Directory Issue vol. 93 No. 1A, Jan., 1995 (3 pages).
Integrated Device Technology Inc.
Knapp Jeffrey T.
Ryan Patrick
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