Plating process

Etching a substrate: processes – Forming or treating electrical conductor article

Reexamination Certificate

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Reexamination Certificate

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10528581

ABSTRACT:
A process for making an electronic device which comprises applying a non-aqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal(s), exposing the plate resistant ink to actinic and/or particle beam radiation to effect polymerisation, adding one or more metal layers by electrolytic or electroless deposition, the upper layer of which is an etch-resistant metal(s), removing the polymerised plate-resistant ink with alkali and finally removing the electrically conductive metal(s) which are optionally directly laminated to the dielectric substrate and not protected by an upper layer of etch-resistant metal(s) by chemical etching wherein the plate-resistant ink is substantially solvent-free and comprises:A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono- or higher functionality wherein 5 to 95% by weight are mono-functional monomers;B) 1 to 30 parts acrylate functional monomer containing one or more acid groups;C) 0 to 20 parts polymer or prepolymer;D) 0 to 20 parts radical initiator;E) 0 to 5 parts colorant;F) 0 to 5 parts surfactant; andwhere the ink has a viscosity of not greater than 30 cPs (mPa·s) at 40° C. and all parts are by weight.

REFERENCES:
patent: 4270985 (1981-06-01), Lipson et al.
patent: 4315985 (1982-02-01), Castellani et al.
patent: 5270368 (1993-12-01), Lent et al.
patent: 5721007 (1998-02-01), Lynch et al.

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