Plating process

Details Plating process Plating process

2008-01-01

2008-01-01

Culbert, Roberts (Department: 1763)

Etching a substrate: processes

Forming or treating electrical conductor article

Reexamination Certificate

active

07314573

ABSTRACT:
A process for making an electronic device which comprises applying a non-aqueous plate-resistant ink by ink jet printing to selected areas of a dielectric substrate, optionally laminated with an electrically conductive metal(s), exposing the plate resistant ink to actinic and/or particle beam radiation to effect polymerisation, adding one or more metal layers by electrolytic or electroless deposition, the upper layer of which is an etch-resistant metal(s), removing the polymerised plate-resistant ink with alkali and finally removing the electrically conductive metal(s) which are optionally directly laminated to the dielectric substrate and not protected by an upper layer of etch-resistant metal(s) by chemical etching wherein the plate-resistant ink is substantially solvent-free and comprises:A) 30 to 90 parts acrylate functional monomers free from acid groups comprising mono- or higher functionality wherein 5 to 95% by weight are mono-functional monomers;B) 1 to 30 parts acrylate functional monomer containing one or more acid groups;C) 0 to 20 parts polymer or prepolymer;D) 0 to 20 parts radical initiator;E) 0 to 5 parts colorant;F) 0 to 5 parts surfactant; andwhere the ink has a viscosity of not greater than 30 cPs (mPa·s) at 40° C. and all parts are by weight.

REFERENCES:
patent: 4270985 (1981-06-01), Lipson et al.
patent: 4315985 (1982-02-01), Castellani et al.
patent: 5270368 (1993-12-01), Lent et al.
patent: 5721007 (1998-02-01), Lynch et al.

Affiliated with

Also associated with

Rating

Plating process does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating process, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating process will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2776722