Plating method with lead or tin sublayer

Details Plating method with lead or tin sublayer Plating method with lead or tin sublayer

1977-01-03

1978-04-04

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 38E, 428626, 428645, 428646, 428648, C25D 512, C25D 556

Patent

active

040826210

ABSTRACT:
A nickel or cobalt layer is electroplated from a fluoborate bath directly onto a lead or lead alloy or tin or tin alloy sublayer, which has been electroplated onto a metal surface. Microcracked chrome is electroplated over the nickel or cobalt layer. With a nonconductive plastic substrate, the sublayer is electroplated onto a metal film which was deposited on the plastic by an electroless method. The plated product includes a sublayer of about 0.05 to 2 mils lead or lead alloy or tin or tin alloy, a second layer of about 0.05 to 2 mils nickel or cobalt, and an outer layer of about 0.001 to 1 mil chrome.

REFERENCES:
patent: 1738748 (1929-12-01), Wirshing et al.
patent: 3009238 (1961-11-01), Wesley et al.
patent: 3471271 (1969-10-01), Brown et al.
patent: 3615281 (1971-10-01), Ramsden
patent: 3661538 (1972-05-01), Brown et al.
patent: 3866289 (1975-02-01), Brown et al.
patent: 3868229 (1975-02-01), Hurley
patent: 3930807 (1976-01-01), Kobayashi et al.

Affiliated with

Also associated with

Rating

Plating method with lead or tin sublayer does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating method with lead or tin sublayer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating method with lead or tin sublayer will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-722476