Plating method for circuitized substrates

Etching a substrate: processes – Forming or treating electrical conductor article

Reexamination Certificate

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C029S852000, C029S847000

Reexamination Certificate

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11128272

ABSTRACT:
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.

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