Etching a substrate: processes – Forming or treating electrical conductor article
Reexamination Certificate
2007-01-30
2007-01-30
Norton, Nadine (Department: 1765)
Etching a substrate: processes
Forming or treating electrical conductor article
C029S852000, C029S847000
Reexamination Certificate
active
11128272
ABSTRACT:
A method of plating a circuit pattern on a substrate to produce a circuitized substrate (e.g., a printed circuit board) in which a dual step metallurgy application process is used in combination with a dual step photo-resist removal process. Thru-holes are also possible, albeit not required.
REFERENCES:
patent: 4532152 (1985-07-01), Elarde
patent: 4702792 (1987-10-01), Chow et al.
patent: 4775611 (1988-10-01), Sullivan
patent: 5063951 (1991-11-01), Bard et al.
patent: 5084071 (1992-01-01), Nenadic et al.
patent: 5118385 (1992-06-01), Kumar et al.
patent: 5160579 (1992-11-01), Larson
patent: 5289639 (1994-03-01), Bard et al.
patent: 5308796 (1994-05-01), Feldman et al.
patent: 5338645 (1994-08-01), Henderson et al.
patent: 5358622 (1994-10-01), Korsten
patent: 5378307 (1995-01-01), Bard et al.
patent: 5468409 (1995-11-01), Dull
patent: 5494781 (1996-02-01), Ohtani et al.
patent: 5502893 (1996-04-01), Endoh et al.
patent: 5512335 (1996-04-01), Miller et al.
patent: 5557844 (1996-09-01), Bhatt et al.
patent: 5792672 (1998-08-01), Chan et al.
patent: 6162365 (2000-12-01), Bhatt et al.
patent: 6547974 (2003-04-01), Albrechta et al.
patent: 2003/0011458 (2003-01-01), Nuytkens et al.
patent: 2003/0071013 (2003-04-01), Tsao et al.
patent: 2003/0162047 (2003-08-01), Appelt et al.
Card Norman A.
Edwards Robert D.
Konrad John J.
Magnuson Roy H.
Wells Timothy L.
Dahimene Mahmoud
Endicott Interconnect Technologies, Inc.
Fraley Lawrence R.
Hinman, Howard & Kattell LLP
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