Plating method by means of an electroless gold plating solution

Details Plating method by means of an electroless gold plating solution Plating method by means of an electroless gold plating solution

1995-10-23

1997-11-25

Utech, Benjamin

Coating processes

Immersion or partial immersion

Metal base

4274431, B05D 118

Patent

active

056910037

ABSTRACT:
A plating method by means of an electroless gold solution under air supply in the form of air bubbles from air dispersing bodies placed on the bottom of a plating tan, whereby more uniform plating can be achieved and the life of the plating solution can be prolonged. Air bubbles are uniformly supplied over the entire region in the plating tank which corresponds to a plating region of a substance to be plated and placed in the plating tank, and the air supply is adjusted depending on the liquid temperature of the plating solution.

REFERENCES:
patent: 4152467 (1979-05-01), Alpaugh et al.
patent: 4388346 (1983-06-01), Bickler
patent: 4616596 (1986-10-01), Helber et al.
patent: 4865888 (1989-09-01), Akaheshi et al.
patent: 5198273 (1993-03-01), Ando et al.
patent: 5284520 (1994-02-01), Tanaka
European Search Report, dated Jan. 29, 1996, EPA Application No. 95307577.7, corresponding to present application (4 pages).

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