Plating method and plating bath precursor used therefor

Details Plating method and plating bath precursor used therefor Plating method and plating bath precursor used therefor

2005-02-08

2005-02-08

Jones, Deborah (Department: 1775)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Depositing predominantly alloy coating

C205S239000, C205S257000, C205S263000, C205S264000, C205S265000, C205S266000, C205S269000, C205S271000, C205S281000, C205S283000, C205S291000, C205S299000, C205S300000, C205S305000, C205S315000, C106S001180, C106S001190, C106S001210, C106S001240, C106S001260, C106S002000, C106S001290, C428S935000, C428S642000, C428S645000, C428S646000, C428S658000, C428S662000, C428S663000, C428S666000, C428S668000, C428S670000, C428S672000, C428S673000, C428S674000, C428S680000, C428S681000

Reexamination Certificate

active

06852210

ABSTRACT:
To provide a plating method, which enables wide industrial use of the redox system electroless plating method having excellent characteristics, and a plating bath precursor which is preferable for the plating method. The plating method comprises a process oxidizing first metal ions of a redox system of a plating bath from a lower oxidation state to a high oxidation state, and second metal ions of said redox system are reduced and deposited onto the surface of an object to be plated, wherein a process is provided in which by supplying the electrical current to the plating bath, the first metal ions are reduced from said lower oxidation state to thereby activate the plating bath. The plating bath precursor is formed stabilizing the plating bath so that reduction and deposition of the second metal ions substantially do not occur in order to improve its storing performance.

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Translation of JP 58-81985.*
“Electroless Copper Plating Using Co(II) Compound as Reducing Agent”, S. Nakao et al., The Surface Finishing Society of Japan Summary Report of the 98th Conference, 19A-34, pp. 33-34.
“The Autocatalytic Deposition of Tin”, M. E. Warwick et al., Transactions of the Institute of Metal Finishing, 1980, vol. 58, pp. 9-14.

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