Plating method and plating apparatus

Details Plating method and plating apparatus Plating method and plating apparatus

2005-07-05

2005-07-05

Wong, Edna (Department: 1753)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Utilizing brush or absorbent applicator

C205S084000, C205S093000, C205S096000, C205S098000, C205S123000, C205S137000, C205S157000

Reexamination Certificate

active

06913681

ABSTRACT:
A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.

REFERENCES:
patent: 3755089 (1973-08-01), Rapids
patent: 4287043 (1981-09-01), Eckert et al.
patent: 4595464 (1986-06-01), Bacon et al.
patent: 6143156 (2000-11-01), Zhang
patent: 54121237 (1979-09-01), None
patent: 4-154122 (1992-05-01), None
patent: 10-28798 (1998-11-01), None

Affiliated with

Also associated with

Rating

Plating method and plating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating method and plating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating method and plating apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3425267