Plating method and method for producing a multi-layered printed

Details Plating method and method for producing a multi-layered printed Plating method and method for producing a multi-layered printed

1993-09-28

1996-05-21

Vo, Peter

Metal working

Method of mechanical manufacture

Electrical device making

29DIG16, 29DIG36, 174266, 216 35, 216 36, 427 97, 427 98, H05K 342, H05K 338, H05K 346

Patent

active

055177581

ABSTRACT:
A dry sandblasting treatment for spraying abrasives onto a surface of an insulating resin layer, a chemical etching for chemically etching the surface, and a plating process for plating a conductive layer on the resulting insulating resin layer are successively performed. Since the surface of the insulating resin layer is roughened by the dry sandblasting treatment and the resulting surface is subjected to the chemical etching, a minute anchor structure is formed on the surface. Accordingly, the adhesion between the insulating resin layer and a plating layer (i.e., a circuit conductive layer) is improved. Due to the dry sandblasting treatment, the shape of a via hole formed in the insulating resin layer is improved, and an exposed surface of the circuit conductor layer and an inner wall of a through-hole are cleaned.

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Vergleichende Untersuchungen an Verschiedenen Vorbehandlungsmethoden fur Unkashierte; Leierplatten-Basismaterialien; vol. 74 (1983) Marz, No. 3, Saulgau Duetschland, pp. 269-274.

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