Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Treating electrolytic or nonelectrolytic coating after it is...
Reexamination Certificate
2007-10-31
2010-06-08
Nguyen, Nam X (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Treating electrolytic or nonelectrolytic coating after it is...
C205S093000, C205S206000
Reexamination Certificate
active
07731833
ABSTRACT:
The present invention relates to methods and apparatus for plating a conductive material on a workpiece surface in a highly desirable manner. Using a workpiece-surface-influencing device, such as a mask or sweeper, that preferentially contacts the top surface of the workpiece, relative movement between the workpiece and the workpiece-surface-influencing device is established so that an additive in the electrolyte solution disposed on the workpiece and which is adsorbed onto the top surface is removed or otherwise its amount or concentration changed with respect to the additive on the cavity surface of the workpiece. Plating of the conductive material can place prior to, during and after usage of the workpiece-surface-influencing device, particularly after the workpiece surface influencing device no longer contacts any portion of the top surface of the workpiece, to achieve desirable semiconductor structures.
REFERENCES:
patent: 5096550 (1992-03-01), Mayer et al.
patent: 5256565 (1993-10-01), Bernhardt et al.
patent: 5486234 (1996-01-01), Contolini et al.
patent: 5863412 (1999-01-01), Ichinose et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6107186 (2000-08-01), Erb
patent: 6121141 (2000-09-01), Woo et al.
patent: 6224737 (2001-05-01), Tsai et al.
patent: 6270647 (2001-08-01), Graham et al.
patent: 6284121 (2001-09-01), Reid
patent: 6315883 (2001-11-01), Mayer et al.
patent: 6346479 (2002-02-01), Woo et al.
patent: 6355153 (2002-03-01), Uzoh et al.
patent: 6375823 (2002-04-01), Matsuda et al.
patent: 6402925 (2002-06-01), Talieh
patent: 6482656 (2002-11-01), Lopatin
patent: 6534116 (2003-03-01), Basol
patent: 6676822 (2004-01-01), Talieh
patent: 6709565 (2004-03-01), Mayer et al.
patent: 6858121 (2005-02-01), Basol
patent: 6867136 (2005-03-01), Basol et al.
patent: 6902659 (2005-06-01), Talieh
patent: 7189647 (2007-03-01), Patton et al.
patent: 2002/0166773 (2002-11-01), Cohen
patent: 2007/0105377 (2007-05-01), Koos et al.
Knobbe Martens Olson & Bear LLP
Nguyen Nam X
Novellus Systems Inc.
Van Luan V
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