Plating method and apparatus

Details Plating method and apparatus Plating method and apparatus

2006-10-10

2006-10-10

King, Roy (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Treating process fluid by means other than agitation or...

C205S088000, C205S123000, C205S205000, C205S210000, C205S227000, C205S278000, C427S294000, C427S299000

Reexamination Certificate

active

07118664

ABSTRACT:
The present invention provides a plating method and apparatus, which is capable of introducing plating solution into the fine channels and holes formed in a substrate without needing to add a surface active agent to the plating solution, and capable of forming a high-quality plating film having no defects or omissions. The plating method for performing electrolytic or electroless plating of an object using a plating solution comprises: conducting a plating operation after or while deaerating dissolved gas in the plating solution; and/or conducting a preprocessing operation using a preprocessing solution after or while deaerating dissolved gas in the preprocessing solution and subsequently conducting the plating operation.

REFERENCES:
patent: 3623962 (1971-11-01), Beale
patent: 4874476 (1989-10-01), Stierman et al.
patent: 4919769 (1990-04-01), Lin
patent: 5013415 (1991-05-01), Hudson
patent: 5262193 (1993-11-01), Louks et al.
patent: 5512162 (1996-04-01), Sachs et al.
patent: 5702583 (1997-12-01), Rischke et al.
patent: 5997712 (1999-12-01), Ting et al.
patent: 6179982 (2001-01-01), Ting et al.
patent: 6258244 (2001-07-01), Ohmi et al.
patent: 879902 (1998-11-01), None
patent: 4-341341 (1992-11-01), None
patent: 10-317158 (1998-12-01), None
F.A. Lowenheim, Electroplating, McGraw-Hill Book Co., New York, pp. 67-80, 1978.
Database WPI, Section C, Week 198517, Derwent Publications Ltd., London, GB; Class M11, AN 1985-101639, XP002377850, & JP 60 046399 A (Katsukawa Kogyo KK), Mar. 13, 1985, *abstract*.

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