Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate
2005-05-24
2009-08-18
Nguyen, Nam X (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
C205S084000, C205S098000
Reexamination Certificate
active
07575664
ABSTRACT:
A cathode potential is applied to a conductive layer formed on a substrate having a depression pattern. A plating solution in electrical contact with an anode is supplied to the conductive layer to form a plating film on the conductive layer. At this time, the plating solution is supplied by causing an impregnated member containing the plating solution to face the conductive layer. Since the plating solution stays in the depression, a larger amount of plating solution is supplied than on the upper surface of the substrate, and the plating rate of the plating film in the depression increases. Consequently, the plating film can be preferentially formed in the depression such as a groove or hole.
REFERENCES:
patent: 1787431 (1931-01-01), Batenburg et al.
patent: 2972882 (1961-02-01), Erwin
patent: 3669868 (1972-06-01), Lieber et al.
patent: 3755089 (1973-08-01), Rapids
patent: 3954570 (1976-05-01), Shirk et al.
patent: 4287043 (1981-09-01), Eckert et al.
patent: 4595464 (1986-06-01), Bacon et al.
patent: 5324552 (1994-06-01), Opower et al.
patent: 5571389 (1996-11-01), Kerampran
patent: 6110345 (2000-08-01), Iacoponi
patent: 6143156 (2000-11-01), Zhang
patent: 54121237 (1979-09-01), None
patent: 55-85692 (1980-06-01), None
patent: 2-225691 (1990-09-01), None
patent: 4-154122 (1992-05-01), None
patent: 10-28798 (1998-11-01), None
patent: 10-298798 (1998-11-01), None
patent: 10298798 (1998-11-01), None
patent: 11-26394 (1999-01-01), None
Notification of Reasons for Rejection from Japanese Patent Office mailed Aug. 19, 2008, in Japanese Application No. 1999-033234, and English translation thereof.
Notification of Reasons for Rejection mailed Mar. 17, 2009, in related Japanese Application No. JP 11-033234.
Kaneko Hisashi
Matsuda Tetsuo
Okumura Katsuya
Finnegan Henderson Farabow Garrett & Dunner L.L.P.
Kabushiki Kaisha Toshiba
Nguyen Nam X
Van Luan V
LandOfFree
Plating method does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating method will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-4073441