Plating method

Details Plating method Plating method

2006-07-07

2008-05-20

Wong, Edna (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating selected area

C205S164000, C205S296000, C205S297000, C205S298000

Reexamination Certificate

active

07374652

ABSTRACT:
Copper plating baths containing a leveling agent that is a reaction product of a compound including a heteroatom chosen from nitrogen, sulfur and a mixture of nitrogen and sulfur, with a polyepoxide compound containing an ether linkage that deposit copper on the surface of an electronic device and in apertures on such substrate are provided. Such plating baths deposit a copper layer on the substrate surface that is substantially planar across a range of electrolyte concentrations. Methods of depositing copper layers using such copper plating baths are also disclosed.

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patent: 6800188 (2004-10-01), Hagiwara et al.
patent: 2003/0106802 (2003-06-01), Hagiwara
patent: 2006/0016693 (2006-01-01), Wang et al.
patent: 1 371 757 (2003-12-01), None
patent: 1 619 274 (2005-07-01), None
patent: WO 2004005528 (2004-01-01), None
Website: http://www.circuitree.com/CDA/ArticleInformation/features/BNP—Features—Item/0,2133; Allardyce et al.; Copper Electroplating Technology for Microvia Filing; Posted Mar. 1, 2004.
Website: http://www.dynatronix.com/copper.htm; Leisner et al.; Throwing Power in Pulse Reverse Plating from an Acid Copper Bath; Jun. 2, 2005.

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