Plating method

Details Plating method Plating method

1997-01-24

1999-02-02

Warden, Robert J.

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Coating contains embedded solid material

205112, 205133, 205176, 427466, 427470, C25D 508

Patent

active

058659765

ABSTRACT:
A method of making a composite structure including at least a plating film disposed on a substrate having at least a surface portion formed from a metallic base material. The method includes the steps of discharging a composite plating solution containing insoluble particles from a nozzle and impacting the composite plating solution on the surface portion of the substrate at a predetermined flow rate. During at least a portion of the discharging and impacting steps, the surface portion of the substrate is abraded with the insoluble particles in the plating solution discharged from the nozzle. A voltage can be applied between the base material and the nozzle, which are electrically connected by the plating solution, to thereby deposit a plating film on the surface portion of the substrate by electroplating.

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