Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating selected area
Reexamination Certificate
2007-01-09
2007-01-09
Nguyen, Nam (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating selected area
C205S129000, C205S137000, C205S138000, C204S198000, C204S206000
Reexamination Certificate
active
10861059
ABSTRACT:
A plating machine for plating a film carrier tape for mounting electronic parts includes a plating tank for plating wiring patterns of a film carrier tape and also has a bubble adhesion prevention means that is position adjustable with respect to the surface of a plating solution contained in the plating tank. The process for producing film carrier tapes for mounting electronic parts comprises partially immersing a film carrier tape in a plating solution contained in a plating tank and selectively plating wiring patterns formed in the immersed area while adsorbing bubbles generated in the plating solution to a bubble adhesion prevention means arranged at the surface of the plating solution.
REFERENCES:
patent: 3267017 (1966-08-01), Greene et al.
patent: 4322280 (1982-03-01), Houska et al.
patent: 11-204585 (1999-07-01), None
patent: 2002317296 (2002-10-01), None
Mitsui Mining & Smelting Co. Ltd.
Nguyen Nam
The Webb Law Firm
Van Luan V.
LandOfFree
Plating machine and process for producing film carrier tapes... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating machine and process for producing film carrier tapes..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating machine and process for producing film carrier tapes... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3741027