Plating encapsulation to inhibit dendritic growth

Details Plating encapsulation to inhibit dendritic growth Plating encapsulation to inhibit dendritic growth

1974-09-12

1976-10-19

Lieberman, Eli

Wave transmission lines and networks

Automatically controlled systems

With control of equalizer and/or delay network

333 70R, 333 70S, H03H 704, H01G 442, H01G 110

Patent

active

039873803

ABSTRACT:
The disclosure relates to EMI filters and the like wherein the possibility of dendrite formation between electrodes is substantially eliminated. This is accomplished by encasing any material forming a part of the filter or the like which is capable of supporting dendrite growth within a material that does not support the growth of dendrites so that any ionized moisture medium cannot come into intimate contact with the material capable of supporting dendrite growth and so that there is no direct path from one dendrite growth supporting electrode across the medium to the other dendrite growth supporting electrode. The encasing material is preferably gold, aluminum or platinum.

REFERENCES:
patent: 3333045 (1967-07-01), Fisher et al.
patent: 3416533 (1968-12-01), Fisher et al.
patent: 3568660 (1971-03-01), Crites
walkiden-"Platinum in Anodes Cathodic Protection Applications-Part 1" in Corrosion Technology Jan. 1962; pp. 14-16.

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