Plating device and plating method

Details Plating device and plating method Plating device and plating method

2005-12-27

2009-06-09

Nguyen, Nam X (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S22400M, C204S212000, C205S130000, C205S138000

Reexamination Certificate

active

07544274

ABSTRACT:
There is provided a plating method and device having a fixed drum (20) in which an anode (21) is exposed on the external peripheral surface; a rotating drum provided on the external periphery of the fixed drum, onto which a workpiece W transported in the longitudinal direction is wound; an annular opening (35) formed at the bottom of the rotating drum and provided so as to penetrate from the external periphery of the rotating drum to the internal periphery continuously in the peripheral direction of the rotating drum; a plating solution feeding channel (22) that leads into the fixed drum and is formed in a position on the external periphery of the fixed drum corresponding to the angle position (52a) of the prescribed arc of contact of the rotating drum onto which the workpiece is wound; a plating device for feeding the plating solution to the flow channel using the tunnel-shaped space (52) enclosed by the workpiece wound on the external periphery of the rotating drum, the peripheral wall of the annular opening, and the external periphery of the fixed drum as the flow channel.

REFERENCES:
patent: 3900383 (1975-08-01), Austin et al.
patent: B 46-6322 (1971-02-01), None
patent: A 51-16238 (1976-02-01), None

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