Chemistry: electrical and wave energy – Processes and products
Patent
1983-02-16
1985-02-05
Kaplan, G. L.
Chemistry: electrical and wave energy
Processes and products
204 40, 204211, 204228, C25D 510, C25D 706
Patent
active
044976950
ABSTRACT:
A method and apparatus for automatically changing a plating thickness in an electrical plating line in which unwanted over-plating is prevented. The plating line includes a plurality of plating tanks through which a member to be plated is conveyed and corresponding plating current sources. As a plating thickness change point on the member to be plated passes through the various tanks, a first plating current corresponding to a first plating thickness is applied through plating current power sources before the plating thickness change point, while a second plating current corresponding to a second plating thickness is applied through plating current power sources of tanks after the plating thickness change point. To prevent arcing as the plating thickness change point passes through the apparatus, plating current application is suspended in the two tanks on either side of the plating thickness change point.
REFERENCES:
patent: 2427661 (1947-09-01), Cook
patent: 2463254 (1949-03-01), Edwards et al.
patent: 3865701 (1975-02-01), Borgmann
patent: 4240881 (1980-12-01), Stanya
Hamada Shigeharu
Komoto Haruo
Shinkai Daisuke
Kaplan G. L.
Leader William T.
Mitsubishi Denki & Kabushiki Kaisha
Nippon Steel Corporation
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