Plating, chemical plating technique using partial chemical...

Details Plating, chemical plating technique using partial chemical... Plating, chemical plating technique using partial chemical...

2007-10-16

2010-11-16

Wong, Edna (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Forming nonelectrolytic coating before depositing...

C205S172000, C205S177000, C205S181000, C205S213000, C205S220000, C205S223000, C205S224000

Reexamination Certificate

active

07833403

ABSTRACT:
This invention involves the technological field of electroplating, chemical plating, specially involves a method for partially plating aluminum and aluminum copper radiators. A radiator is conducted partial chemical oxidation and enclosure before undergoing galvanization. Firstly oxidize the non-plate surface of the radiator by chemical oxidation, then utilize a sealing compound to fill up tiny holes of the porous layer to make a film thereon against the erosion of acid and alkali, and then process common chemical plating or electroplating. Only plate a weldable nickel-phosphorus alloy on the touching parts at where the aluminum radiator or the aluminums and copper radiator connect with the main frame.

REFERENCES:
patent: 11181597 (1999-07-01), None

Affiliated with

Also associated with

Rating

Plating, chemical plating technique using partial chemical... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating, chemical plating technique using partial chemical..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating, chemical plating technique using partial chemical... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4237986