Electrolysis: processes – compositions used therein – and methods – Electroforming or composition therefor – Recording device
Patent
1996-10-15
1997-11-04
Gorgos, Kathryn L.
Electrolysis: processes, compositions used therein, and methods
Electroforming or composition therefor
Recording device
204212, 204238, 204264, 204273, 205 70, 205 99, 205148, C25D 1702, C25D 2110
Patent
active
056835647
ABSTRACT:
A plating cell for plating a flat substrate, for example, a stamper for a high-density compact disk recording, employs a sparger to introduce a flow of electrolyte across the surface of the substrate to be plated. A fluid-powered rotary blade or wiper within the cathode chamber has a rotary blade with an edge spaced a small distance, preferably about three-eighths inch, from the substrate, and an annular turbine which rotates under a flow of the electrolytic fluid that is also being fed to the sparger. The rotary wiper is run at a speed between about 35 and 80 rpm and draws the electrolyte away from the substrate. This helps remove hydrogen bubble that form during electroplating. A semipermeable weir separates the cathode chamber from an anode chamber that contains an anode basket that is filled with plating material. The plating cell is provided with a backwash flow regime so that impurities and inclusions from the anode chamber are kept out of the plating bath.
REFERENCES:
patent: 2744860 (1956-05-01), Rines
patent: 3788965 (1974-01-01), Holsinger
patent: 4269669 (1981-05-01), Soby et al.
patent: 4391694 (1983-07-01), Runsten
patent: 4435266 (1984-03-01), Johnston
patent: 4686014 (1987-08-01), Pellegrino et al.
patent: 5197673 (1993-03-01), Sullivan
patent: 5217536 (1993-06-01), Matsumura et al.
patent: 5514258 (1996-05-01), Brinket et al.
Gorgos Kathryn L.
Leader William T.
Reynolds Tech Fabricators Inc.
LandOfFree
Plating cell and plating method with fluid wiper does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating cell and plating method with fluid wiper, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating cell and plating method with fluid wiper will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-1830151