Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate
2006-05-17
2008-07-29
Wilkins, III, Harry D. (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
C205S117000
Reexamination Certificate
active
07404886
ABSTRACT:
The present invention relates to methods for plating a conductive material on a substrate surface in a highly desirable manner. The invention removes at least one additive adsorbed on the top portion of the workpiece more than at least one additive disposed on a cavity portion, thereby allowing plating of the conductive material take place before the additive fully re-adsorbs onto the top portion and causing greater plating of the cavity portion relative to the top portion.
REFERENCES:
patent: 4024029 (1977-05-01), Rain et al.
patent: 4110176 (1978-08-01), Creutz et al.
patent: 5516412 (1996-05-01), Andricacos et al.
patent: 5567300 (1996-10-01), Datta et al.
patent: 5807165 (1998-09-01), Uzoh et al.
patent: 5862605 (1999-01-01), Horie et al.
patent: 6004880 (1999-12-01), Liu et al.
patent: 6074546 (2000-06-01), Sun et al.
patent: 6090239 (2000-07-01), Liu et al.
patent: 6176992 (2001-01-01), Talieh
patent: 6224737 (2001-05-01), Tasi et al.
patent: 6245676 (2001-06-01), Ueno
patent: 6251235 (2001-06-01), Talieh et al.
patent: 6270647 (2001-08-01), Graham et al.
patent: 6284121 (2001-09-01), Reid
patent: 6303014 (2001-10-01), Taylor et al.
patent: 6346479 (2002-02-01), Woo et al.
patent: 6352623 (2002-03-01), Munks et al.
patent: 6354916 (2002-03-01), Uzoh et al.
patent: 6375823 (2002-04-01), Matsuda et al.
patent: 6402925 (2002-06-01), Talieh
patent: 6436267 (2002-08-01), Carl et al.
patent: 6471847 (2002-10-01), Talieh et al.
patent: 6482656 (2002-11-01), Lopatin
patent: 6497800 (2002-12-01), Talieh et al.
patent: 6506103 (2003-01-01), Ohmori et al.
patent: 6534116 (2003-03-01), Basol
patent: 6600229 (2003-07-01), Mukherjee et al.
patent: 6610190 (2003-08-01), Basol et al.
patent: 6653226 (2003-11-01), Reid
patent: 6676822 (2004-01-01), Talieh
patent: 6833063 (2004-12-01), Basol
patent: 6848970 (2005-02-01), Manens et al.
patent: 6867136 (2005-03-01), Basol et al.
patent: 6902659 (2005-06-01), Talieh
patent: 6936154 (2005-08-01), Basol et al.
patent: 6942780 (2005-09-01), Basol et al.
patent: 6958114 (2005-10-01), Talieh et al.
patent: 2003/0054729 (2003-03-01), Lee et al.
patent: 1 063 696 (2000-12-01), None
patent: 1 122 989 (2001-08-01), None
patent: 11-238703 (1999-08-01), None
patent: 2000208443 (2000-07-01), None
patent: WO 01/32362 (2001-05-01), None
Reid, Jon, et al., Factors influencing damascene feature fill using copper PVD and electroplating,Solid State Technology, Jul. 2000, 7 pages.
Knobbe Martens Olson & Bear LLP
Mendez Zulmariam
Novellus Systems Inc.
Wilkins, III Harry D.
LandOfFree
Plating by creating a differential between additives... does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating by creating a differential between additives..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating by creating a differential between additives... will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3962723