Plating bath for electrodeposition of aluminum and plating proce

Details Plating bath for electrodeposition of aluminum and plating proce Plating bath for electrodeposition of aluminum and plating proce

1989-04-19

1990-03-06

Tufariello, T. M.

Chemistry: electrical and wave energy

Processes and products

C25D 344

Patent

active

049063421

ABSTRACT:
In the plating for electrodeposition of aluminum using a non-aqueous solution, a plating bath is prepared to comprise a low-melting plating bath, which comprises a molten mixture comprising an aluminum halide and a dialkyl-and/or trialkylpyridinium halide represented by the following formula: ##STR1## wherein R.sup.1 represents an alkyl group having 1 to 12 carbon atoms, R.sup.2 represents a hydrogen atom or an alkyl group having 1 to 6 carbon atoms, R.sup.3 represents an alkyl group having 1 to 6 carbon atoms, and X represents a halogen atom; and said alkyl groups each refer to a straight-chain hydrocarbon group, a branched hydrocarbon group, an alicyclic hydrocarbon group, or any of these further partly containing an aromatic hydrocarbon group,
by which the bath life, operability in handling, conductivity, and current efficiency can be improved.

REFERENCES:
patent: 2446331 (1948-08-01), Hurley
patent: 2446349 (1948-08-01), Wier et al.
patent: 2446350 (1948-08-01), Wier
patent: 4747916 (1988-05-01), Kato et al.
R. Suchentrunk, Corrosion Protection by Electro-Deposited Aluminum, Z. Werkstofftech, vol. 12, 1981, pp. 190-206.
D. E. Couch et al., A. Hydride Bath for the Electrodeposition of Aluminum, Journal of Electrochemical Society, vol. 99, No. 6 Jun. 1952, pp. 234-244.

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