Plating bath and method for electroplating tin and/or lead

Details Plating bath and method for electroplating tin and/or lead Plating bath and method for electroplating tin and/or lead

1986-02-06

1987-05-05

Kaplan, G. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 541, C25D 332, C25D 336, C25D 356, C25D 360

Patent

active

046629998

ABSTRACT:
An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoride and fluoborate ions and comprise (A) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (B) at least one alkane sulfonic acid or alkanolsulfonic acid, (C) at least one surfactant, (D) an effective amount of at least one primary brightening agent selected from the group consisting of halogen substituted and dialkoxy and trialkoxy substituted benzaldehydes, (E) an effective amount of a secondary brightening agent which is at least one lower aliphatic aldehyde, and (F) an effective amount of an auxiliary brightening agent which is at least one of the group consisting of aniline and the amino-, carboxy-, halo-, alkyl- or alkoxy-substituted anilines. Methods for the electrodeposition of tin, lead, or tin-lead alloys from such baths also are described.

REFERENCES:
patent: 4000047 (1976-12-01), Ostrow et al.
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4459185 (1984-07-01), Obata et al.
patent: 4565609 (1986-01-01), Nobel et al.
patent: 4582576 (1986-04-01), Opaskar et al.

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