Plating bath and method for electroplating tin and/or lead

Details Plating bath and method for electroplating tin and/or lead Plating bath and method for electroplating tin and/or lead

1985-03-26

1986-04-15

Andrews, R. L.

Chemistry: electrical and wave energy

Processes and products

204 53, 204 54R, 106 122, 106 125, C25D 358

Patent

active

045825769

ABSTRACT:
An aqueous acidic plating bath for electrodeposition of tin, lead or tin-lead alloys on a substrate is described. The plating baths are free of fluoborate and comprise (a) at least one bath-soluble metal salt selected from the group consisting of a stannous salt, a lead salt, or a mixture of stannous and lead salts, (b) at least one alkane sulfonic acid or alkanolsulfonic acid, (c) at least one nonionic, cationic or amphoteric surfactant, (d) an effective amount of at least one primary brightening agent selected from the group consisting of aromatic aldehydes, acetophenones, and carbonyl compounds having the general formula

REFERENCES:
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patent: 2525942 (1950-10-01), Proell
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patent: 3984291 (1976-10-01), Lerner et al.
patent: 4132610 (1979-01-01), Dohi et al.
patent: 4459185 (1984-07-01), Obata et al.

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