Compositions: coating or plastic – Coating or plastic compositions – Metal-depositing composition or substrate-sensitizing...
Reexamination Certificate
2005-06-28
2005-06-28
Wong, Edna (Department: 1753)
Compositions: coating or plastic
Coating or plastic compositions
Metal-depositing composition or substrate-sensitizing...
C106S001260, C106S001270, C106S001280, C106S001290, C205S261000, C205S264000, C205S265000, C205S267000, C205S281000, C205S290000, C205S296000
Reexamination Certificate
active
06911068
ABSTRACT:
A metal plating bath containing organic compounds that inhibit or retard the consumption of plating bath additives. The additives are chemical compounds that improve the brightness of the plated metal, the physical properties of the plated metal especially with respect to ductility and the micro-throwing power as well as the macro-throwing power of the plating bath. The organic compounds that inhibit or retard the consumption of additives increases the life of the plating bath and improves the efficiency of the plating process. The plating baths containing the organic compounds that inhibit or retard additive consumption can be employed to copper, gold, silver, palladium, platinum, cobalt, cadmium, chromium, bismuth, indium, rhodium, ruthenium, and iridium.
REFERENCES:
patent: 4129482 (1978-12-01), Lash
patent: 4416742 (1983-11-01), Kinase et al.
patent: 4441969 (1984-04-01), Tremmel
patent: 2000248397 (2000-09-01), None
Kruglikov et al. “Use of a Rotating Disk Electrode for Evaluating the Leveling Action of Some Additives in a Cooper-Plating Sulfate Electrolyte”, Trudy Instituta—Moskovskii Khimiko-Tekhnologicheskii Institut Imeni D. I. Mendeleeva (no month, 1970), No. 67, pp. 236-239.
Barstad Leon R.
Buckley Thomas
Cobley Andrew J.
Kapeckas Mark J.
Reddington Erik
Piskorski John J.
Shipley Company L.L.C.
Wong Edna
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