Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Agitating or moving electrolyte during coating
Reexamination Certificate
2005-04-05
2005-04-05
Valentine, Donald R. (Department: 1742)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Agitating or moving electrolyte during coating
C204S273000, C118S400000
Reexamination Certificate
active
06875333
ABSTRACT:
A plating apparatus is provided to allow the whole area of a target plating surface of a wafer to be subjected to more uniform plating treatment and moreover enables a target plating surface of a wider area to be subjected to positive and uniform plating treatment. In the plating apparatus which has a stirring bar within a plating tank and which performs plating treatment of a target plating surface of the wafer while stirring a plating solution near the target plating surface of the wafer by moving the stirring bar, the stirring bar is rotated while being oscillated in a motion plane substantially parallel to the target plating surface of the wafer. By this operation, the occurrence of an eddy flow of the plating solution is suppressed during stirring and it becomes possible to positively carry out more uniform plating treatment of a wider region.
REFERENCES:
patent: 4102756 (1978-07-01), Castellani et al.
patent: 6251250 (2001-06-01), Keigler
patent: 6322689 (2001-11-01), Omasa
patent: 11-092947 (1999-04-01), None
patent: 11-163015 (1999-06-01), None
patent: 2002-115096 (2002-04-01), None
patent: 2002-129384 (2002-05-01), None
patent: 2002-020890 (2002-07-01), None
patent: 2001-064795 (2004-03-01), None
Electroplating Engineers of Japan Limited
Roberts & Roberts, L.L.P.
Valentine Donald R.
LandOfFree
Plating apparatus for wafer does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Plating apparatus for wafer, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating apparatus for wafer will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3397379