Chemistry: electrical and wave energy – Apparatus – Electrolytic
Reexamination Certificate
2007-12-25
2007-12-25
Nguyen, Nam (Department: 1753)
Chemistry: electrical and wave energy
Apparatus
Electrolytic
C204S230200
Reexamination Certificate
active
10930823
ABSTRACT:
The present invention provides a plating apparatus for a substrate which can plate a substrate under uniform pressure without increasing a load to be applied while holding the entire surface of a porous member in contact with the surface, to be plated, of the substrate. The plating apparatus for a substrate, includes: a substrate holder for holding a substrate; a cathode unit having a seal member for abutting against and sealing, in a water-tight manner, a peripheral portion of a surface, to be plated, of the substrate held by the substrate holder, and a cathode electrode which is brought into contact with the substrate to supply current to the substrate. An anode which is vertically moveable is disposed in confronting relation to the surface, to be plated, of the substrate; a plating solution impregnated material is disposed between the anode and the surface, to be plated, of the substrate, the plating solution impregnated material being made of a water-retentive material; and a porous member is disposed between the plating solution impregnated material and the surface, to be plated, of the substrate. The plating solution impregnated material is constructed of a plurality of separate members.
REFERENCES:
patent: 6402925 (2002-06-01), Talieh
patent: 6534116 (2003-03-01), Basol
patent: 6632335 (2003-10-01), Kunisawa et al.
patent: 6736952 (2004-05-01), Emesh et al.
patent: 6913681 (2005-07-01), Matsuda et al.
Baker Brett
Deligianni Hariklia
Kanda Hiroyuki
Kurashina Keiichi
Mishima Koji
Ebara Corporation
Nguyen Nam
Van Luan V.
Wenderoth , Lind & Ponack, L.L.P.
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