Plating apparatus, cartridge and copper dissolution tank for...

Details Plating apparatus, cartridge and copper dissolution tank for... Plating apparatus, cartridge and copper dissolution tank for...

2007-10-09

2007-10-09

Wilkins, III, Harry D (Department: 1742)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S237000

Reexamination Certificate

active

10620728

ABSTRACT:
A plating apparatus provided with: three copper dissolution tanks connected to a plating liquid circulation path for supplying copper ions to a plating liquid; a buffer container for supplying a replacement liquid into some of the copper dissolution tanks not in use; and an undiluted replacement liquid supplying section for supplying an undiluted replacement liquid as a source of the replacement liquid into the buffer container. Copper mesh members each prepared by weaving a copper wire, straight copper pipes or copper plates are accommodated as a copper source in each of the copper dissolution tanks. The copper dissolution tanks each include a detachable cartridge, in which the copper mesh members or the like are disposed.

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