Plating apparatus and plating method

Details Plating apparatus and plating method Plating apparatus and plating method

2006-07-28

2010-10-12

Wilkins, III, Harry D (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Agitating or moving electrolyte during coating

C204S237000, C204S212000

Reexamination Certificate

active

07811440

ABSTRACT:
A plating apparatus performs a plating process while placing a work in a pod disposed in a plating bath storing a plating solution. The pod has a pair of meshes that allow the plating solution to pass but substantially inhibit the work from passing. The plating apparatus is provided with a solution flowing mechanism for flowing the plating solution out of the pod through one of the pair of meshes.

REFERENCES:
patent: 5851368 (1998-12-01), Rumph
patent: 6228230 (2001-05-01), Li et al.
patent: 2001/0045360 (2001-11-01), Omasa
patent: 1 203 645 (1970-08-01), None
patent: A-53-150816 (1978-11-01), None
patent: A-05-320993 (1993-12-01), None
patent: A 09-137295 (1997-05-01), None
English translation of Japanese Office Action issued in Application No. P2006-091457; mailed Oct. 20, 2009.

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