Plating apparatus and plating method

Details Plating apparatus and plating method Plating apparatus and plating method

2005-10-07

2010-06-15

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S222000, C204S228100

Reexamination Certificate

active

07736474

ABSTRACT:
A plating apparatus securely carries out a flattening plating of a substrate to form a plated film having a flat surface without using a costly mechanism, and without applying an extra plating to the substrate. The plating apparatus includes a substrate holder; a cathode section having a seal member for watertightly sealing a peripheral portion of the substrate, and a cathode electrode for supplying an electric current to the substrate; an anode disposed in a position facing the surface of the substrate; a porous member disposed between the anode and the surface of the substrate; a constant-voltage control section for controlling a voltage applied between the cathode electrode and the anode at a constant value; and a current monitor section for monitoring an electric current flowing between the cathode electrode and the anode, and feeding back a detection signal to the constant-voltage control section.

REFERENCES:
patent: 3880725 (1975-04-01), Van Raalte et al.
patent: 6375823 (2002-04-01), Matsuda et al.
patent: 2002/0096435 (2002-07-01), Matsuda et al.
patent: 2003/0000840 (2003-01-01), Kimura et al.
patent: 2004/0154931 (2004-08-01), Hongo et al.

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