Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Contacting coating as it forms with solid member or material...
Reexamination Certificate
2004-12-21
2009-06-30
Nguyen, Nam X (Department: 1795)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Contacting coating as it forms with solid member or material...
C205S137000
Reexamination Certificate
active
07553400
ABSTRACT:
A plating method is capable of mechanically and electrochemically preferentially depositing a plated film in fine interconnect recesses such as trenches and via holes, and depositing the plated film to a flatter surface. The plating method including: disposing a substrate having fine interconnect recesses such that a conductive layer faces an anode; disposing a porous member between the substrate and the anode; filling a plating solution between the substrate and the anode; and repeating a process of holding the conductive layer and the porous member in contact with each other and moving the conductive layer and the porous member relatively to each other, a process of passing an electric current between the conductive layer and the anode while keeping the conductive layer still with respect to the porous member, and a process of stopping the supply of the electric current between the conductive layer and the anode.
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Andricacos Panayotis
Baker Brett
Deligianni Hariklia
Kanda Hiroyuki
Kimizuka Ryoichi
Ebara Corporation
International Business Machines Corporation (IBM)
Nguyen Nam X
Van Luan V
Wenderoth , Lind & Ponack, L.L.P.
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