Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Coating predominantly semiconductor substrate
Reexamination Certificate
2006-09-19
2006-09-19
Nguyen, Nam (Department: 1753)
Electrolysis: processes, compositions used therein, and methods
Electrolytic coating
Coating predominantly semiconductor substrate
C204S212000, C204S213000, C204S214000
Reexamination Certificate
active
07108776
ABSTRACT:
In the invention, there is provided a plating treatment technique which permits uniform plating treatment and easy replacement of articles to be plated without the effect of bubbles in a plating solution by improving wet plating apparatuses of the contact type to thereby solve problems such as the removal of bubbles in a plating solution and the removal of an adhering plating solution. Provided is a plating apparatus having a plating tank, which comprises: an opening which has a solution seal to prevent a plating solution from leaking when an article to be plated is placed on the opening; a solution-supply portion which supplies the plating solution; a solution-discharge portion which discharges the plating solution; and an anode which is opposed to the article to be plated that is placed, wherein the plating tank has rotational means for rotating the plating tank itself.
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Sasabe Kenichi, et al., “Plating Device and Plating Method”, Patent Abstracts of Japan, Publ. Num. 2001-049495, Date of Publication Feb. 20, 2001.
Electroplating Engineers of Japan Limited
Nguyen Nam
Roberts & Roberts, LLP
Van Luan V.
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