Plating apparatus and plating method

Details Plating apparatus and plating method Plating apparatus and plating method

2005-10-25

2005-10-25

Smith, Matthew (Department: 2823)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S232000

Reexamination Certificate

active

06958113

ABSTRACT:
A plating apparatus for plating a substrate. The apparatus is provided with a plating unit, a substrate cleaning unit, a substrate transport mechanism, a post-treatment agent supplying section, a minor constituent managing section for managing minor constituents (an accelerator, a retarder and chlorine) of a plating liquid being used in the plating unit, an enclosure which houses therein a substrate treating section including the plating unit, the cleaning unit and the substrate transport mechanism, and a system controller for controlling the entire apparatus.

REFERENCES:
patent: 4132605 (1979-01-01), Tench et al.
patent: 4326940 (1982-04-01), Eckles et al.
patent: 4605626 (1986-08-01), Beck
patent: 4692346 (1987-09-01), McBride et al.
patent: 4917774 (1990-04-01), Fisher
patent: 5192403 (1993-03-01), Chang et al.
patent: 5192509 (1993-03-01), Surjaatmadja et al.
patent: 5368715 (1994-11-01), Hurley et al.
patent: 6254760 (2001-07-01), Shen et al.
patent: 6267853 (2001-07-01), Dordi et al.
patent: 6270635 (2001-08-01), Woo
patent: 6350362 (2002-02-01), Geisler et al.
patent: 6365033 (2002-04-01), Graham et al.
patent: 6551488 (2003-04-01), Hey et al.
patent: 6558518 (2003-05-01), Sendai et al.
patent: 6572753 (2003-06-01), Chalyt et al.
patent: 6592736 (2003-07-01), Fulton et al.
patent: 6627066 (2003-09-01), Isayama et al.
patent: 2004/0016644 (2004-01-01), Isayama et al.
patent: 5214594 (1993-08-01), None
patent: 820417 (1996-03-01), None
patent: 457544 (2001-10-01), None

Affiliated with

Also associated with

Rating

Plating apparatus and plating method does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating apparatus and plating method, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating apparatus and plating method will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3483155