Plating apparatus and plating liquid removing method

Details Plating apparatus and plating liquid removing method Plating apparatus and plating liquid removing method

2007-07-10

2007-07-10

Wilkins, III, Harry D. (Department: 1742)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

C205S157000, C134S021000, C134S023000, C134S024000, C134S033000, C134S034000, C134S902000, C427S099500, C427S443100

Reexamination Certificate

active

10740630

ABSTRACT:
A plating apparatus and a plating liquid removing method removes a plating liquid remaining on a substrate-contacting portion, or portions in its vicinity, of a substrate holding member. The plating apparatus comprises a head having a rotatable housing provided with a substrate holding member for holding a substrate, a plating process container, disposed below the head, for holding a plating liquid therein, and a plating liquid removing mechanism for removing plating liquid remaining on the substrate-contacting portion, or the portions in its vicinity, at an inner circumferential edge of the substrate holding member.

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