Plating apparatus and method

Details Plating apparatus and method Plating apparatus and method

2006-09-26

2006-09-26

Nguyen, Nam (Department: 1753)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S198000, C204S211000, C205S130000, C205S138000

Reexamination Certificate

active

07112264

ABSTRACT:
A plating apparatus includes a plating vessel for holding a plating bath containing at least metal ions, a conveying device for conveying a long conductive substrate and immersing the long conductive substrate in the plating bath, a facing electrode disposed in the plating bath so as to face one surface of the conductive substrate, a voltage application device for performing plating on the one surface of the conductive substrate by applying a voltage between the conductive substrate and the facing electrode, and a film-deposition suppression device fixedly disposed in the plating vessel so that at least a portion of the film-deposition suppression means is close to shorter-direction edges of the conductive substrate. At least a portion of the film-deposition suppression device close to the shorter-direction edges of the conductive substrate is conductive. By holding the conductive portion of the film-deposition suppression device and the conductive substrate at substantially the same potential, film deposition on the other surface of the conductive substrate is suppressed.

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