Plating apparatus and method

Details Plating apparatus and method Plating apparatus and method

2005-02-22

2005-02-22

Lamb, Brenda A. (Department: 1734)

Coating apparatus

Control means responsive to a randomly occurring sensed...

Temperature responsive

C118S064000

Reexamination Certificate

active

06858084

ABSTRACT:
The present invention relates to an electroless plating apparatus which can reduce an amount of a plating liquid to be used, maintain a stable plating process, be downsized, reduce an apparatus cost, form a film having a uniform thickness over an entire surface, and prevent a plating liquid from being deteriorated due to a temperature rise. The present invention comprises: a holding device for holding a substrate with a surface, to be plated, facing upwardly; a plating liquid holding mechanism for sealing a periphery of the surface, to be plated, of the substrate held by the holding device; an electroless plating treatment liquid supply device for supplying an electroless plating liquid to the surface, to be plated, of the substrate sealed by the plating liquid holding mechanism to allow supplied electroless plating liquid to be held on the substrate; and a heating apparatus provided below the substrate.

REFERENCES:
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patent: 6544585 (2003-04-01), Kuriyama et al.
patent: 6599563 (2003-07-01), Grunwald
patent: 64-079377 (1989-03-01), None
patent: 02-310393 (1990-12-01), None
patent: 10-280157 (1998-10-01), None
patent: 11-92949 (1999-04-01), None
patent: 2000-064087 (2000-02-01), None
patent: 2001-192845 (2001-07-01), None

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