Plating apparatus

Details Plating apparatus Plating apparatus

2011-03-08

2011-03-08

Bell, Bruce F (Department: 1759)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S297030, C204S297060, C204S297080, C204S297090, C204S297100, C204S297140, C204S22400M

Reexamination Certificate

active

07901550

ABSTRACT:
A plating apparatus can form a plated film having a uniform thickness over the entire surface of a substrate without a change of members. The plating apparatus includes a substrate holder, a cathode contact for contacting a conductive film formed on the substrate so that the conductive film serves as a cathode, a ring-shaped seal member for covering the cathode contact and bringing its inner circumferential portion into contact with the peripheral portion of the substrate to seal the peripheral portion of the substrate, an anode disposed so as to face the conductive film formed on the substrate, and an auxiliary cathode disposed with respect to the seal member such that at least part of the auxiliary cathode is exposed on a surface of the seal member. Plating is carried out by bringing the conductive film, the anode and the auxiliary cathode into contact with a plating solution.

REFERENCES:
patent: 6589401 (2003-07-01), Patton et al.
patent: 2005/0023149 (2005-02-01), Nakada et al.
patent: 2005/0145482 (2005-07-01), Suzuki et al.
patent: 2008/0099340 (2008-05-01), Kanda et al.
patent: 2009/0095634 (2009-04-01), Makino et al.

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