Plating apparatus

Details Plating apparatus Plating apparatus

2011-01-11

2011-01-11

Wilkins, III, Harry D (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C205S131000, C204S275100, C204S277000

Reexamination Certificate

active

07867368

ABSTRACT:
A plating apparatus has a tubular electrode (16) placed in a hollow section (12) of work (11). The tubular electrode (16) has a through-hole (16a) formed in the longitudinal direction. A circular tube-like gap (S1) in which a plating liquid (17) flows is formed between the tubular electrode placed in the hollow section and an inner peripheral wall (14) of the hollow section. The plating liquid flows spirally from the lower end of the gap to the upper end by action of a vortex producing flow path (29) communicating to the lower end of the gap. The plating liquid having reached the upper end circulates through the through-hole of the tubular electrode.

REFERENCES:
patent: 4279706 (1981-07-01), Blanc et al.
patent: 4345977 (1982-08-01), Blanc et al.
patent: 4853099 (1989-08-01), Smith
patent: 5516417 (1996-05-01), Kondou et al.
patent: 5540829 (1996-07-01), Mase et al.
patent: 5620575 (1997-04-01), Karasawa et al.
patent: 5660704 (1997-08-01), Murase
patent: 5865962 (1999-02-01), Ikegaya
patent: 2003/0079996 (2003-05-01), Nozaki et al.
patent: 2004/0211672 (2004-10-01), Ishigami et al.
patent: 56-40148 (1981-04-01), None
patent: 63-206496 (1988-08-01), None
patent: 02-015193 (1990-01-01), None
patent: 04-000400 (1992-01-01), None
patent: 07-118891 (1995-05-01), None
patent: 07-157897 (1995-06-01), None
patent: 08-261055 (1996-10-01), None

Affiliated with

Also associated with

Rating

Plating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-2654657