Plating apparatus

Chemistry: electrical and wave energy – Apparatus – Electrolytic

Patent

Rate now

  [ 0.00 ] – not rated yet Voters 0   Comments 0

Details

204225, 204297R, C25D 1702, C25D 1706

Patent

active

044473060

ABSTRACT:
Apparatus is provided for plating a portion of an object. The apparatus has a cut out section in one of its side walls. Engagement is maintained between the object and the cut out edges, through a sealing means and adjustable set screw means. This forms a liquid-tight tank in which is disposed an anode and plating liquid. The anode is electrically connected for plating on the object.

REFERENCES:
patent: 1771680 (1930-07-01), Ishisaka
patent: 2135873 (1938-11-01), Jones et al.
patent: 4069121 (1978-01-01), Baud et al.
patent: 4081347 (1978-03-01), Becker
patent: 4290867 (1981-09-01), Jumer

LandOfFree

Say what you really think

Search LandOfFree.com for the USA inventors and patents. Rate them and share your experience with other people.

Rating

Plating apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating apparatus will most certainly appreciate the feedback.

Rate now

     

Profile ID: LFUS-PAI-O-1601283

  Search
All data on this website is collected from public sources. Our data reflects the most accurate information available at the time of publication.