Plating apparatus

Details Plating apparatus Plating apparatus

2006-02-15

2009-06-02

Wilkins, Harry (Department: 1795)

Chemistry: electrical and wave energy

Apparatus

Electrolytic

C204S229900, C204S196010, C204S196110, C204S230100, C204S230700

Reexamination Certificate

active

07540946

ABSTRACT:
A plating apparatus for plating a substrate comprises a power supply for generating a voltage between a pair of terminals; an anode connected to one terminal of the power supply; a main cathode connected to the other terminal of the power supply while in contact with the substrate; an auxiliary cathode connected to the other terminal of the power supply while out of contact with the substrate; a main resistance R1connected in series between the other terminal of the power supply and the main cathode; and an auxiliary resistance R2connected in series between the other terminal of the power supply and the auxiliary cathode.

REFERENCES:
patent: 2975111 (1961-03-01), Reimert et al.
patent: 55152200 (1980-11-01), None
patent: U-58-101882 (1983-07-01), None
patent: U-59-54566 (1984-04-01), None
patent: A 10-092602 (1998-04-01), None
patent: A 2000-054198 (2000-02-01), None
English abstract of JP 55152200 from East.

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