Plating apparatus

Details Plating apparatus Plating apparatus

2006-06-13

2006-06-13

Ryan, Patrick (Department: 1745)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Involving measuring, analyzing, or testing

C204S238000, C204S263000, C204S269000

Reissue Patent

active

RE039123

ABSTRACT:
The plating apparatus has a plating section in which a plating process is performed and a control section for regulating the plating solution. The plating section includes a plating bath containing plating solution, an anode provided in the plating solution, and a plating object serving as a cathode placed in the plating solution opposite the anode. The control section includes a regulating tank for regulating the composition and/or concentration of the plating solution, and a replenishing tank for injecting solution into the plating solution in the regulating tank. The plating apparatus also includes a mechanism for circulating plating solution between the regulating tank in the control section and the plating bath in the plating section. The plating section is installed in a first room, while the control section is installed in a second room, which is separate from the first room Accordingly, contamination in the plating section is prevented.

REFERENCES:
patent: 3658470 (1972-04-01), Zievers et al.
patent: 6299753 (2001-10-01), Chao et al.
patent: 5-179496 (1993-07-01), None
patent: 10-121297 (1998-05-01), None

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