Plating anodized aluminum substrates

Details Plating anodized aluminum substrates Plating anodized aluminum substrates

1982-12-27

1984-02-14

Kaplan, G. L.

Stock material or miscellaneous articles

All metal or with adjacent metals

Composite; i.e., plural, adjacent, spatially distinct metal...

428632, 428648, 428675, 204 33, 204 38A, 204 30, 427304, C25D 544, C25D 1116

Patent

active

044317077

ABSTRACT:
Nickel and copper are plated over a thick anodic coating on an aluminum substrate as a step in the manufacture of printed circuit board substrates.

REFERENCES:
patent: 2905600 (1959-09-01), Franklin
patent: 3674658 (1972-07-01), Van Asperen et al.
patent: 3725108 (1973-04-01), Saubestre et al.
patent: 3914126 (1975-10-01), Pinsler
patent: 3943039 (1976-03-01), Wittrock
patent: 4100038 (1978-07-01), Jongkind
patent: 4211619 (1980-07-01), Usbeck
"The Surface Treatment and Finishing of Aluminium and its Alloys", Wernick and Pinner, Third Edition, 1964, p.: Title, XXVI, XXVII, 594-606.
American Electroplaters Society Research Project 41, "Adhesion Failure of Electrodeposited Coatings on Anodized Aluminum Alloys," Thomas, Oct. 1982.
"Phosphoric Acid Anodize as Pre-Plate Treatment for Aluminum,"0 Wittrock, Annual Technical Conference AES 66, Jun. 24-28.

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