Plating and production methods for producing a fine metal...

Details Plating and production methods for producing a fine metal... Plating and production methods for producing a fine metal...

2007-05-22

2007-05-22

Kopec, Mark (Department: 1751)

Compositions

Electrically conductive or emissive compositions

C252S521200, C252S519330, C427S127000, C427S216000

Reexamination Certificate

active

10487345

ABSTRACT:
A method of producing a fine metal component where a plated coating is deposited on a conductive film exposed at fine through-hole pattern portions in a mold to produce a fine metal component, wherein the conductive film is made using a conductive paste comprised of a metal powder in which the metal particles are magnetically linked together in a chain shape.

REFERENCES:
patent: 4923739 (1990-05-01), Jin et al.
patent: 5851644 (1998-12-01), McArdle et al.
patent: 6620344 (2003-09-01), Sano et al.
patent: 08-273431 (1996-10-01), None
patent: 8-273431 (1996-10-01), None
patent: 09-194768 (1997-07-01), None
patent: 2000-124662 (2000-04-01), None
patent: P2000-124662 (2000-04-01), None
patent: 2001-0853397 (2001-03-01), None
patent: P2001-85397 (2001-03-01), None
patent: 2001-200305 (2001-07-01), None
patent: P2001-200305 (2001-07-01), None
patent: 2003-147570 (2003-05-01), None
patent: P2003-147570 (2003-05-01), None
http://www.minerals.net/resource/property/magnetic.htm.
Taiwan Office Action issued in Corresponding Taiwan Patent Application No. 091133924, dated Jul. 24, 2006.

Affiliated with

Also associated with

Rating

Plating and production methods for producing a fine metal... does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Plating and production methods for producing a fine metal..., we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Plating and production methods for producing a fine metal... will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3767753