Plating analyzing method and apparatus

Details Plating analyzing method and apparatus Plating analyzing method and apparatus

2004-09-22

2009-06-09

Nogueroia, Alex (Department: 1795)

Electrolysis: processes, compositions used therein, and methods

Electrolytic coating

Involving measuring, analyzing, or testing

C205S794000, C205S775000, C204S298030, C703S002000

Reexamination Certificate

active

07544280

ABSTRACT:
A plating analyzing method is disclosed for analyzing an electroplating system having an anode, a cathode and plating liquid, based on a Laplace's equation. The method comprises the steps of making the Laplace's equation discrete by Finite Volume Method; forming simultaneous equations based on the discrete Laplace's equation; and calculating potential distribution using the simultaneous equations. A plating analyzing apparatus is also disclosed, which comprises a unit for making the Laplace's equation discrete by Finite Volume Method and dividing the system into a plurality of elements; potential calculating unit for forming simultaneous equations based on the discrete Laplace's equation, and calculating potential distribution using the simultaneous equations; and current density calculating unit for calculating current density distribution based on the potential distribution.

REFERENCES:
patent: 6542784 (2003-04-01), Amaya et al.
patent: 2001-152397 (2001-06-01), None
patent: 2002-180295 (2002-12-01), None
Pruis, G.W., et al. “A Comparison of Different Numerical Method for Solving the Forward Problem in EEG and MEG”, Physiological Measurement, vol. 14, Supplement 4A, Nov. 1, 1993, pp. A1-A9.
Nakajima, K., et al. “Comparison of Finite Element and Finite Volume Methods for Incompressible Viscous Flows”, American Institute of Aeronuatics and Astronautics Journal, vol. 32, No. 5, May 1994, pp. 1090-1093.

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