Abrading – Precision device or process - or with condition responsive... – By optical sensor
Reexamination Certificate
2006-05-09
2006-05-09
Hail, III, Joseph J. (Department: 3723)
Abrading
Precision device or process - or with condition responsive...
By optical sensor
C451S005000
Reexamination Certificate
active
07040957
ABSTRACT:
In a chemical mechanical wafer processing apparatus, a platen for supporting a polishing pad, a manifold for delivering a chemical to the platen, a workpiece substantially in contact with a polishing pad supported by the platen, a light transmission medium for transmitting and receiving light to and from the workpiece, one end of the medium being substantially flush with the top of the polishing pad, the other end of the transmission medium having a hollow portion for receiving a light transmitting and receiving probe, thereby providing a light transmitting and receiving probe in close proximity to the workpiece. The platen and manifold of the apparatus are substantially of non-metallic material and may be joined by spaced clamps and latches.
REFERENCES:
patent: 5433651 (1995-07-01), Lustig et al.
patent: 5527424 (1996-06-01), Mullins
patent: 5584750 (1996-12-01), Ishida et al.
patent: 5605760 (1997-02-01), Roberts
patent: 5609511 (1997-03-01), Moriyama et al.
patent: 5738574 (1998-04-01), Tolles et al.
patent: 5743788 (1998-04-01), Vanell
patent: 5762536 (1998-06-01), Pant et al.
patent: 5838447 (1998-11-01), Hiyama et al.
patent: 5893796 (1999-04-01), Birang et al.
patent: 5943302 (1999-08-01), Fanshaw
patent: 5949927 (1999-09-01), Tang
patent: 6012967 (2000-01-01), Satake et al.
patent: 6045439 (2000-04-01), Birang et al.
patent: 6068539 (2000-05-01), Bajaj et al.
patent: 6106662 (2000-08-01), Bibby, Jr. et al.
patent: 6146242 (2000-11-01), Treur et al.
patent: 6203417 (2001-03-01), Dyer et al.
patent: 6254453 (2001-07-01), Li et al.
patent: 6280297 (2001-08-01), Tolles et al.
patent: 6454630 (2002-09-01), Tolles
patent: 6485354 (2002-11-01), Wolf
patent: 6488568 (2002-12-01), Treur et al.
patent: 6544104 (2003-04-01), Koike et al.
patent: 6599765 (2003-07-01), Boyd et al.
patent: 6641470 (2003-11-01), Zhao et al.
patent: 0 824 995 (1998-02-01), None
patent: WO 01/15861 (2001-08-01), None
Herb John D.
Marquardt Dave
Schultz Stephen C.
Hail III Joseph J.
Ingrassia Fisher & Lorenz PC
Muller Bryan R.
Novellus Systems Inc.
LandOfFree
Platen and manifold for polishing workpieces does not yet have a rating. At this time, there are no reviews or comments for this patent.
If you have personal experience with Platen and manifold for polishing workpieces, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Platen and manifold for polishing workpieces will most certainly appreciate the feedback.
Profile ID: LFUS-PAI-O-3524461