Platelet metal powder for coating a substrate

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board

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Details

75 05AA, 75 05BA, 75251, B05D 100, B22F 100

Patent

active

045130205

ABSTRACT:
The present invention is for a flat platelet powder for deposition onto a substrate. The powder is formed by fracture of brittle sheet or ribbon. The resulting powder has a faceted outline formed by fracture. The powder of the present invention produces a dense deposit.

REFERENCES:
patent: 4297135 (1981-10-01), Giessen et al.

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